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CTO David Aldape, 具有超過(guò)30年的行業(yè)經(jīng)驗(yàn)，他帶領(lǐng)一支專業(yè)的研發(fā)工程師隊(duì)伍, 致力于不斷加強(qiáng)當(dāng)前生產(chǎn)工藝以 及先進(jìn)技術(shù)的研發(fā)工作。
2016-2017研發(fā)項(xiàng)目：提高厚徑比到30:1或更高；大而薄的背板能力；阻抗控制公差降到±5%或更小；先進(jìn)電鍍和光成形方法介紹；
提高層間對(duì)位的先進(jìn)工具系統(tǒng)；持續(xù)驗(yàn)證新物料，用于HDI, 高速低損，更薄結(jié)構(gòu)和組件應(yīng)用（如ZETA?，I-Tera?, I-speed?,Tachyon G100?,Megtron7N,andEMC 891k&890）；深微孔研究（L1-L3，厚徑比1:1或更大）；散熱方案：金屬芯板，導(dǎo)電漿（Ormet和Tatsuta）埋元器件PCB板
| Technology Roadmap 技術(shù)路線 | |||||
|---|---|---|---|---|---|
| inch [mm] | 標(biāo)準(zhǔn) | 批量 | 樣品 | 研發(fā) | |
| 關(guān)鍵屬性 | 層數(shù) | Up to 32L | Up to 40L | 40L 到 48L | >50+L |
| 最小/最大厚度 | 012” [.30]/.200" [5.0] | .008" [.20]/.256" [6.5] | .006” [.15]/.315" [8.0] | TBD/≥.394" [10.0] | |
| 最大 pnl 尺寸 | 24x28[610x712] | 24x30 [610 x 760] | 24x32 [610 x 812] | 待定 | |
| 最小線寬線距（銅厚） | 內(nèi)層 | .003" [.076] H | .0025" [.064] H | <.002" [.05] H | <.002" [.05] H |
| 外層 | .004" [.10] 1 | .003" [.076] 1 | <.0025" [.064] 1 | <.0025" [.064] 1 | |
| 公差 | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.005] | ±.0002" [.005] | |
| 機(jī)械孔大小 | 最小鉆咀 | .008" [.20] | .006" [.15] | .005" [.13] | .004" [.10] |
| 孔pad直徑 | +.008" [.20] | +.008" [.20] | +.006" [.15] | .004" [.10] | |
| 厚徑比 | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| Base copper weights: 1=1oz H=1/2 oz, T=3/8 oz, Q=1/4 oz | |||||
| 孔結(jié)構(gòu) | 鐳射孔層 | 2+N+2 | 3+N+3 | 4+N+4,ELIC | UNiFYi MVs |
| 埋孔 | Yes | Yes | Yes | Yes | |
| 疊孔 | Stacked/Staggered | Offset/Staggered | Offset/Staggered | Offset/Staggered | |
| 鐳射孔 | 最小孔 | .004" [.10] | .003" [.076] | .002" [.05] | .002" [.05] |
| 孔pad直徑 | +.006" [.15] | +.004" [.10] | +.003" [.76] | +.003" [.076] | |
| 厚徑比 | 0.8:1 | 0.8:1 | 1:1 | 1.2:1 | |
| 導(dǎo)通&非導(dǎo)通填孔 | 最小孔徑 | .008" [.20] | .006" [.15] | .005" [.13] | <.005" [.13] |
| 厚徑比 | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| 阻焊 | 對(duì)位精度 | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
| 最小開(kāi)窗 | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
| 最小綠油橋 | .003" [.08] | .002" [.05] | .0015" [.038] | Eng Eval | |
| 表面處理 | ENIG, OSP | ENEPIG | Thick Gold Multiple Finishes | 待定 | |
| Im Sn, Im Ag | Wire Bondable Gold | ||||
| LF HASL | Multiple Finishes | ||||
| Hard Gold Body | |||||
| 物料選擇 | Rogers 3000/4000 | Ultra Low Loss Dk/Df | 埋線 埋元件 | ||
| Halogen Free FR4 EMC 828, EMC 888K | I-Tera? I-Speed? EMC 891K | Tachyon 100G? MetroWave | |||
| Buried Capacitance | Polyimid, Megtron 6N | Megtron 7N, EMC 890K | |||
| 408 HR Nelco-13s | Hybrid PCBs | Thermal Management PCBs | |||
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